The 7th International Conference on New Energy and Future Energy Systems (NEFES 2022)

Abstract: Microelectronic devices are increasingly becoming miniaturized, especially in the semiconductor industry. The miniaturization of these Microelectronic technologies has significantly increased their power density. To meet the goals of achieving iindustrial revolution (IR 4.0), most manufacturing companies such as power transformers, battery banks of electric vehicles, CPU, industrial inverters and electronic circuit boards are continuously shifting towards downsizing. Thermal energy dissipation is the main challenge limiting these microelectronics’ reliability and efficiency. In this research work, cooling performance of new design overlap heat sinks was investigated, two different designs were simulated using ANSYS FLUENT. Design 1 is a heat sink with trapezoidal fillet and symmetrical half-round pins in horizontal arrangement. Design 2 is a heat sink with half parabolic fillet and symmetrical half-round pins in a horizontal arrangement. Each design consists of 0% overlap ratio (non-overlap), 50% overlap ratio (partial-overlap) and 100% overlap ratio (fully-overlap). The accuracy of the results of this study was validated with experimental data. The findings from this study make several contributions to the current literature through heat transfer enhancement and electrical power stack space minimization. The results show that the partial overlap design has the highest Nusseslt number, followed by non-overlap and fully-overlap heatsink. At a velocity of 2m/s, the performance for non-overlap, partial overlap and fully overlap are 0.45, 0.25 and 0.15, respectively. The deterioration of the performance was due to increase in pressure drop penalty. Design 1 with fully overlap has about 30 % increase in pressure drop compared with design 2. Interestingly the heat transfer coefficient of partial overlap design (Design 1) is about 12W/m2.K which is about 36.6 % increase in heat transfer coefficient. In terms of space minimization, the fully overlap heat sink can be applied in minimizing electrical stack cabinet space, however for heat transfer characteristics, the partial overlap heat sink has a better performance.